Ngokombiko we-Graphical Research isibikezelo esisha sokukhula esinesihloko esithi “Asia Pacific Field Programmable Gate Array (FPGA) Usayizi Wemakethe, By Process Technology (<28 nm, 28 nm – 90 nm,>90 nm), By Architecture (SRAM, Flash, Anti -fuse), Ngokucushwa (I-FPGA yobubanzi obuphansi, i-FPGA yobubanzi obuphakathi, i-FPGA yobubanzi obuphezulu), Ngohlelo Lokusebenza (I-Consumer Electronics, Izimoto, Izimboni, Isikhungo Sokuxhumana & Nedatha, I-Aerospace & Defence, Telecom), Umbiko Wokuhlaziywa Kwemboni, Isifunda I-Outlook (i-China, i-India, i-Japan, i-Australia, i-South Korea), Amandla Okukhula, Isabelo Semakethe Esincintisanayo nesibikezelo, 2020 – 2026” Usayizi uzoba cishe ku-USD 5.5 bhiliyoni ngo-2026.
Ukukhula kwemakethe ye-FPGA yase-Asia Pacific kudalwe ukukhula kokusetshenziswa kobuchwepheshe be-Intanethi Yezinto (IoT) ezikhungweni zikahulumeni, amabhange kanye namabhizinisi esifundeni. I-FPGA inikezela ngezinzuzo ezimbalwa ezinhlelweni ze-IoT njengokuvumelana nezimo ukwenza ngokwezifiso ihadiwe nesoftware, ukuphepha okuqinile, nokwandisa isikhathi sokumaketha. Isibonelo, uHulumeni wase-India wethule uhlelo lwe-'Smart City Mission' lokuthuthukiswa kwengqalasizinda yasemadolobheni kusetshenziswa ubuchwepheshe be-AI ne-IoT. Imizamo enjalo yentuthuko kungenzeka ikhulise ukwamukelwa kwemishini yekhompiyutha eshumekiwe, isekele ukukhula kwemakethe eminyakeni ezayo.
Ingxenye yobuchwepheshe benqubo ye-<28nm kulindeleke ukuthi ikhule ku-CAGR engaphezu kwe-14% emakethe yase-Asia Pacific FPGA. Ukukhula kubangelwa intuthuko nentuthuko eqhubekayo ekwakhiweni nakubuchwepheshe be-FPGA ukuze kuthuthukiswe ulwazi lwamakhasimende. Izinkampani ezikhiqiza i-FPGA ezihlanganisa i-Xilinx, i-Intel Corporation, ne-Microchip Technology, phakathi kwezinye, zisaqhubeka nokubhekana noshintsho kubuchwepheshe bezinqubo engxenyeni engu-<28nm kanye nobuchwepheshe bakamuva be-7nm obuthengiswa ngempumelelo emakethe.
Ingxenye yokucushwa kwe-FPGA ebangeni eliphansi ikhombisa ithuba elikhulu lokukhula emakethe, likhula ku-CAGR ye-13% ngesikhathi somugqa wesikhathi wokubikezela. Ukukhula kwengxenye kungenxa yokwanda kwesidingo samadivayisi asebenzisa amandla aphansi njengezinto zikagesi eziphathwayo, okokusebenza okungenantambo, izimoto, kanye namadivayisi ekhompyutha asemaphethelweni. Ukucushwa kwe-FPGA yebanga eliphansi kunikeza izici ezimbalwa ezihlanganisa ubunzima obuncishisiwe ku-chip, ukuminyana okunengqondo okuphansi, nokusebenza kahle kwamandla aphezulu.
Ingxenye yesicelo se-elekthronikhi yabathengi kulindeleke ukuthi ikhule ku-CAGR ye-11% ngesikhathi sokubikezela. Izisombululo ze-FPGA zisetshenziswa emikhiqizweni eminingi kagesi yabathengi okuhlanganisa amakhamera edijithali, ama-smartphones, ama-consoles amageyimu, nama-smart TV, phakathi kokunye. Izinkampani zigxile ekusetshenzisweni kobuchwepheshe be-AI kumishini kagesi yabathengi ukuletha ukuhlukaniswa kwemikhiqizo ekunikezeni kwabo kanye nokukhulisa isidingo sabo emakethe. Isibonelo, ngoJuni 2020, i-Intel Corporation ibambisene ne-Udacity, Inc. ukwethula izixazululo ze-FPGA ezenziwe nge-AI zamadivayisi asemaphethelweni e-AI afana nama-smartphone, amaphilisi, nokunye.
Abadlali ababalulekile emakethe ye-FPGA yase-Asia Pacific bagxile emisebenzini eqhubekayo ye-R&D futhi babuka ukuthuthukiswa komkhiqizo nokusungula izinto njengendlela enenzuzo yokwanda kwemakethe. Isibonelo, ngoNovemba 2019, i-GOWIN Semiconductor Corporation yethula i-mSoC FPGAs ngomsakazo ohlanganisiwe we-Bluetooth 5.0 Low Energy, ohlinzeka ngamakhono ekhompyutha asemaphethelweni asekelwe ekwakhiweni kwe-FPGA. Abanye babadlali ababalulekile emakethe yi-AGM Micro, Gowin Semiconductor Corp., Shenzhen Pango Microsystems, Taiwan Semiconductor Manufacturing Company (TSMC), kanye neXian Intelligence Silicon Tech, phakathi kwabanye.
Isicelo sesampula salo mbiko @ https://www.graphicalresearch.com/request/1427/sample
