I-3D IC kanye ne-2.5D IC Packaging Market Ikulungele Ukuba Inani Elingaphezu Kwezigidigidi ezingama-USD 730 ngo-2027 | I-CAGR 35.9%

Phakathi nenhlekelele ye-COVID-19, i- I-3D IC yomhlaba wonke kanye ne-2.5D IC Packaging Market Ilinganiselwa ku-USD 86.8 Bilion ngonyaka ka-2020, kulindeleke ukuthi ifinyelele kusayizi obuyekeziwe we-USD 730 Bilion ngo-2027, ikhule ku-CAGR ka-35.9% esikhathini sokuhlaziya sika-2020-2027.

I-3D IC iwuhlobo lwe-metal oxide semiconductor ekhiqizwa ngokuxhumanisa amawafa e-silicon amile ame mpo. Ukupakishwa kwama-dies kwenziwa ukuze asebenze njengomshini owodwa. Lokhu kuthuthukisa ukusebenza futhi kunciphisa amandla. Inqubo ye-2.5D IC ihlanganisa ukupakisha amafa. Kodwa-ke, amaphakheji awawodwa futhi ama-dies aphenywa ku-silicon interposer.

I-3D IC kanye ne-2.5D IC Abashayeli Bemakethe Yokupakisha:

Esinye sezici eziyinhloko zokukhula kwemakethe ukwanda kwesidingo sezakhiwo zesekethe ezisezingeni eliphezulu ezimpahleni zikagesi. Le phakheji ye-3D IC ne-2.5D IC ingezinye ezihamba phambili ekwakhiweni kukagesi. Ukupakishwa kwe-3D IC kuyingxenye ebalulekile yamadivayisi kagesi amancane asungulayo. Ukuthengiswa okwandayo kwalawa magajethi kagesi amancane kunomthelela oqondile ezimbonini ze-2.5D IC kanye ne-3D IC emhlabeni jikelele.

Ukupakishwa kwe-Global 3D IC kuyathuthuka ngenxa yezitayela ezifana nokuhlanganisa ibhulokhi le-2D libe yi-chip ye-3D, izikhungo zekhompuyutha nedatha kanye namakhyubhu enkumbulo ayingxube. I-Intel Corp imemezele ukuthi ikhiphe inguqulo yakamuva ye-3D ICs namaphakethe we-2.5D IC ngomqondo. I-Intel Corp izimisele ngokuba umholi ekupakishweni okuthuthukisiwe kwezinhlaka zamasango ahlelekayo.

Ukuze uthole ulwazi mayelana nokuqagela okucatshangwayo ocwaningweni, landa incwajana ye-pdf: https://market.us/report/3d-ic-and-2-5d-ic-packaging-market/request-sample/

Amathrekhi Akhiye Wemakethe

Ingxenye Ye-Consumer Electronics Kulindeleke Ukuba Ibambe Isabelo Semakethe Esikhulu

Imboni eyinhloko yabasebenzisi bokugcina yabathengisi be-semiconductor i-electronics yabathengi. Ukukhula kwalesi sigaba kuqhutshwa imakethe ekhulayo yama-smartphone, ukwanda kokusetshenziswa kwamadivayisi ahlakaniphile nezinto ezigqokwayo kanye nokungena okwandayo kwamadivayisi we-IoT kwezicelo zabathengi ezifana namakhaya ahlakaniphile.

Nalu Uhlu LWABADLALI ABAHLE KAHLE Abasohlwini lwe-3D IC kanye ne-2.5D IC Packaging Market Report yilezi: 

I-Taiwan Semiconductor
Samsung Electronics
Toshiba Corp.
Ubunjiniyela be-Semiconductor Ethuthukisiwe
I-Amkor Technology

Ukuthuthukiswa Kwamuva

February 2022 - I-Shanghai Micro Electronics Equipment Group(SMEE) imemezele ukuthi ilethe isitephu sokuqala sokupakisha se-chip sokuqala sase-China esingu-2.5D/3D. Ihambisana nemikhiqizo ephezulu esigabeni sayo. I-SMEE iyifemu yemishini ye-semiconductor elawulwa uhulumeni ebike ukuthi umkhiqizo omusha uhlose ukupakisha ama-chips amakhulu kakhulu kukhompyutha esebenza kahle kakhulu kanye ne-AI ye-high-end.

Novemba 2021: I-Samsung Electronics Co yaseNingizimu Korea yethula i-H-Cube, ubuchwepheshe bokupakisha be-chip obuvumela ukupakishwa okuncane kwama-chips asebenza kahle. Ubuchwepheshe bakamuva bokupakisha be-semiconductor be-2.5D obuvela ku-tech giant manje sebutholakalela amakhasimende e-Artificial Intelligence (AI), isikhungo sedatha yekhompuyutha esebenza kahle kakhulu kanye nemikhiqizo yenethiwekhi edinga ukupakishwa kwendawo enkulu.

I-3D IC kanye ne-2.5D IC Isigaba Semakethe Yokupakisha:

I-3D IC kanye ne-2.5D IC Packaging Market ihlukaniswe ngezinhlobo ezahlukahlukene nezinhlelo zokusebenza ngokuya ngohlobo lomkhiqizo nesigaba. NgokweValue kanye Nomthamo ukukhula kwemakethe kubalwe ngokuhlinzeka nge-CAGR yesikhathi sokubikezela sonyaka ka-2022 kuya ku-2032.

Izinhlobo Ezibaluleke Kakhulu Ze-3D IC kanye ne-2.5D IC Packaging Market zifakwe kulo Mbiko:

Iphakheji ye-chip-scale ye-3D wafer-level
I-3D TSV
2.5D

I-3D IC kanye ne-2.5D IC Izicelo Zomkhiqizo Wokupakisha Wemakethe:

Logic
Imaging & optoelectronics
Memory
I-MEMS/izinzwa
LED
Power

Ububanzi bombiko @ https://market.us/report/3d-ic-and-2-5d-ic-packaging-market/

Idatha yamazwe aphezulu efakwe kulo mbiko: 

• I-North America (United States, Canada neMexico) 
• IYurophu (iJalimane, i-UK, iFrance, i-Italy, iRussia neTurkey njll.) 
• I-Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia neVietnam) 
• INingizimu Melika (Brazil, Argentina, Columbia njll.) 
• I-Middle East ne-Afrika (Saudi Arabia, UAE, Egypt, Nigeria neNingizimu Afrika)

Imibuzo Evame Ukubuzwa Ngemakethe Yomhlaba Wonke ye-3D IC kanye ne-2.5D IC Packaging

• Ingakanani inani elilinganiselwe le-Global Market ye-3D IC kanye ne-2.5D IC Packaging?
• Yimiphi imithelela enemininingwane ye-COVID - 19 emakethe?
• Lithini izinga lokukhula kweMakethe Yomhlaba Wonke ye-3D IC kanye ne-2.5D IC Packaging?
• Ungakanani usayizi obikezelwe Wemakethe Yomhlaba Wonke ye-3D IC kanye ne-2.5D IC Packaging?
• Obani izinkampani ezibalulekile kuGlobal Market ye-3D IC kanye ne-2.5D IC Packaging?
• Yiziphi izinkambiso zamanje ezizoba nomthelela emakethe eminyakeni embalwa ezayo?
• Yiziphi izici zokushayela, imingcele namathuba emakethe?
• Iziphi izibikezelo zesikhathi esizayo ezingasiza ekuthatheni izinyathelo zamasu ezengeziwe?

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